The supplier of digital, sustainable packaging solutions has seamlessly integrated the machine into its current digital printing process and will use it to produce sustainable and luxury packaging.
ECOLEAF is a metallisation process for graphic arts and provides a sustainable solution for premium packaging and an alternative to hot and cold foiling.
According to ACTEGA, ECOLEAF reduces the CO2 footprint by more than 50% compared to hot and cold foiling. The technology also reduces waste as only the exact amount of material needed is used.
An ECOLEAF metallisation unit can be integrated inline into narrow web printing presses, and offline into finishing equipment.
Matt Dass, joint managing director of Springfield Solutions says ECOLEAF fits the company’s mission to be a “world leader” in the production of innovative and sustainable digital packaging assets as more customers are asking for environmentally friendly packaging.
As we continue our journey to Net Zero, innovative solutions such as ECOLEAF will play a key part in the future of our business and how packaging is developed”
“ECOLEAF’s metallisation technology allows brands to do this without having to compromise on quality, retaining a premium look and feel,” Dass explains, adding: “As we continue our journey to Net Zero, innovative solutions such as ECOLEAF will play a key part in the future of our business and how packaging is developed.”
Paolo Grasso, sales director of ACTEGA Metal Print, adds: “ECOLEAF is designed to provide brands with the high quality and visual impact that comes from adding metallic decorations to labels and packaging, but with a smaller environmental and economic footprint.
“In Springfield Solutions, we have a partner that always looks for ways to offer their customers cutting-edge solutions that support their sustainability goals. These objectives align perfectly and, as such, we are confident that we are at the beginning of a very exciting alliance that will enable both companies to lead the way in the sustainable transformation of the packaging industry.”
The partnership was announced at Packaging Innovations and Empack at the NEC in May.
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