IPIA sets date for key networking event
More than 130 print professionals are expected to attend the IPIA Annual Networking Lunch on June 18th in Birmingham
We round up some of the key companies exhibiting at the event, including Durst Group, GEW, and XSYS
Labelexpo Americas 2024 will open its doors tomorrow, running until September 12th. The biennial show, organised by Informa Markets and taking place at the Donald E. Stephens Convention Center in Chicago, is the largest dedicated label and package printing event in the Americas. Over 400 exhibitors are expected to take part, with a key focus this year on RFID technology, flexible packaging and automation.
We round up some of the key companies exhibiting at the event, including Durst Group, GEW and XSYS.
Digital imaging systems company, Durst Group, has announced its lineup of products for this year’s Labelexpo.
Returning to Labelexpo Americas for a second time is the Durst Tau RSCi. The inkjet label printer, designed for both short- and long-run jobs, prints at 1200 x 1200dpi with up to 95% pantone coverage. This year the RSCi will be featured with Durst Hawk AI, a technology that utilises camera vision systems to automate print quality adjustments in real time at full speed, resulting in significantly reduced waste and overall improved print quality.
Alongside the RSCi will be the brand-new KJet hybrid press. Launched at drupa 2024, the KJet is being touted by Durst as a “full labels factory in one press.”
The KJet combines dual servo flexo printing units and die cutting alongside Durst's RSCi inkjet technology, coupled with an ultra-short web path that aims to minimise waste and reduce set-up times.
Steve Lynn, director of labels and packaging at Durst, explains: “We are shaping the future with the technology we are showing here at Labelexpo. We have paired the fastest printers, offering the highest quality and productivity on the market, with next-level intelligence technology, and we really look forward to sharing that with everyone at Labelexpo Americas.”
UV LED manufacturer GEW, a UK company with a subsidiary in the USA, is set to introduce two new products at Labelexpo.
AeroLED2 will be launched as a successor to GEW’s air-cooled AeroLED UV curing system. The AeroLED2 is reported to deliver an increased power level when compared to the original AeroLED model, allowing for faster printing across more applications.
Also being introduced is the LeoLED2, again a successor to the first LeoLED. It introduces two power level options to its water-cooled system. The regular power option offers modest gains over the original LeoLED, while maintaining backward compatibility. The high power option, however, is said to bring sizeable increases in UV irradiance and dose over its predecessor.
Robert Rae, managing director of sales at GEW, comments: “We have so much to offer the customer across such a broad range of UV curing applications. Now, with the introduction of AeroLED2 and LeoLED2 to our range, we have the highest performing, most reliable LED systems in the market.”
XSYS, a global supplier to the label and packaging markets, will be teaming up with its North American distributor, Anderson & Vreeland, to showcase its solutions for the flexo tag and label market.
The new innovations being showcased by XSYS at the expo are specifically aimed at reducing environmental footprints.
Among the products being showcased will be the ThermoFlexX EcoFillX and Catena ProServX, both of which have been developed to improve efficiency and sustainability.
EcoFill is a feature for ThermoFlexX imagers that significantly reduces washout solvent usage by targeting the non-image areas of the flexographic plate. Catena ProServX is a cloud-based, real-time equipment monitoring tool, which aims to help optimise OEE (Overall Equipment Effectiveness) and reduce waste.
Speaking of its presence at the event, Eric Gibbs, director of sales for XSYS in North America, says: “As a global leader in flexo platemaking and printing solutions, it is important for XSYS to stay involved in important events such as Labelexpo and to take part in discussions that help shape the future of our community.
“We always seek to nurture all our industry relationships while staying up to date with the latest market trends and industry developments to support our customers.”
With hundreds of exhibitors at the expo, there is plenty more to look out for at the event.
Narrow- and mid-web printing company, Mark Andy, will use tomorrow’s event for the global launch of its new P-series S9 press. The technology, engineered for both flexible packaging and labels markets, will be available in both a 22-inch and 26-inch format.
Other new launches include products from HP, which will mark the US launch of the latest press in its 20000-series, the HP Indigo 200k. The digital press is said to greatly increase productivity over previous generations in the series.
On September 12th, the Label Academy will present a half-day-long workshop on RFID in labels and package printing, which is sponsored by Avery Dennison. Topics set to be delivered by industry experts will include a comprehensive overview of RFID technology, including the equipment required to convert, test, and encode RFID labels and tags.
Tasha Ventimiglia, group director for the Americas at Informa Markets, says of the event: “We are really excited to be returning to the most game-changing event for the label and package printing industry in the Americas.”
Speaking of the event in more detail, Ventmiglia continues: “From networking to discovering new products, solutions and technologies in RFID, flexible packaging and automation, Labelexpo Americas 2024 presents a perfect opportunity for the industry to come together all under one roof to see the latest innovations that are shaping the future of this dynamic industry.”
